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4 board setup and configuration before boot, Board setup and configuration before boot, 22 tightening heatsink on the srm and board – Intel Core 2 Duo User Manual

Page 30: Figure 22

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Intel Core 2 Duo Processor and Intel Q35 Express Chipset—Setting Up and Configuring the

Development Kit

Intel

®

Core

TM

2 Duo Processor and Intel

®

Q35 Express Chipset Development Kit

User’s Manual

October 2007

30

Order Number: 318476001US

3.4

Board Setup and Configuration before Boot

Follow the steps below to operate the board.

Warning:

Before starting, ensure the power supply is not connected to the board.

Ensure a safe and static-free work environment before removing any components from

their anti-static packaging. The Development Platform is susceptible to electrostatic

discharge, which may cause failure or unpredictable operation.

The Development Platform must be operated on a flame retardant surface because a

chassis is not included with the platform.

Caution:

Connecting the wrong cable or reversing a cable may damage the board and may

damage the device being connected. Since the board is not in a protective chassis, use

caution when connecting cables to the board.

Caution:

The power supply cord is the main disconnect device to main power (AC power). The

socket outlet should be installed near the equipment and should be readily accessible.

To avoid shock, ensure that the power cord is connected to a properly wired and

grounded receptacle. Do not connect/disconnect any cables or perform installation/

maintenance of the boards in this product during an electrical storm. Ensure that any

equipment to which this product will be attached is also connected to properly wired

and grounded receptacles.

Note:

Ensure that setting up the ATX power supply is the final step performed in the process

of assembly.

1. Physically inspect the motherboard for obvious defects. Note that each reference

board has been tested prior to distribution, but a visual check should be performed

to ensure no damage has occurred during shipping.

Figure 22.

Tightening Heatsink on the SRM and Board