Ivoclar Vivadent Telio Lab - Manual (Page 33)

The light-curing Telio Lab LC materials are layered onto the incisal and occlusal area of the reduced milled
Telio Lab and/or Telio CAD restorations. The limited application of layering material permits achieving
highly esthetic restorations in an efficient manner.
– Always pay attention to the contact points and margins during polishing!
– As an alternative, the ground surface can be blasted with Al
2
O
3
, 100 µm at 1-2 bar /15-29 psi pressure.
– Thoroughly clean with the steam jet and dry with oil-free air
– Apply preferably a cold-curing MMA-based monomer (e.g.Telio Lab Cold Liquid, Telio Activator); the
reaction time/dough time is min. 2 to max. 4 minutes.
– After that, condition the surface with SR Composiv in order to ensure a sound bond between the
restoration and the layering materials. The layer thickness of SR Composiv must be between 0.2 and
0.5 mm. The material is cured in a light-polymerization device (see SR Composiv Instructions for Use).
Characterization with light-curing Telio Lab LC materials
Telio Lab LC materials include light-curing veneering
materials in paste form as well as characterization
stains.
The targeted grinding of the transition areas to the
cut-back regions is the prerequisite for the smooth
transition between Telio Lab / Telio CAD and the
light-curing Telio Lab LC material.
The cut-back technique is not recommended for:
• Build-up of incisal edges in anterior teeth exposed to high protrusion stress
• Build-up of stress-bearing cusps in posterior teeth
Telio
Lab/T
elio
CAD
–
Cut-back
technique
with
Telio
Lab
LC
(light-curing)
Telio Lab / Telio CAD
Cut-back technique with Telio Lab LC
(light-curing)
33