Kontron COMe-bCD2 - Manual (Page 8)

2 Introduction
Kontron User's Guide ETXexpress® CD 8
2 Introduction
2.1 COMe-bCD2
Based on the COM Express standard, Kontron‟s COMe-bCD2, powered by a variety of Intel Pentium core
duo processors, is a next-generation embedded module that brings advanced technology to tomorrow‟s
applications, as well as continuing today‟s legacy devices. Built around serial differential signaling
technologies, COMe-bCD2 modules incorporate the following interfaces into a 95 x 125 small form factor
embedded module:
Core 2 Duo / Core Duo / Celeron M
PCI Express, which provides a high performance I/O infrastructure with transfer rates
starting at 2.5 Giga transfers per second over a x1 PCI Express lane
PCI
Serial ATA (SATA II)
USB 2.0
LVDS
Intel High Definition Audio
Advanced Configuration and Power Interface (ACPI) for optimized power
management
The COMe-bCD2 is built around the Intel Core Duo processors that use the Yonah and Merom Cores and
the Mobile Intel 945GME Express chipset, which is the first mobile platform to offer PCI Express
functionality with extended life cycle support. These modules feature the most current desktop features
such as USB 2.0, SATA, and PCI Express buses.
The COMe-bCD2 delivers up to 2GHz performance and up to 2GB DDR2 RAM. For applications that require
advanced real-time video capabilities, the COMe-bCD2 has integrated graphics based on the Intel®
Graphics Media Accelerator 900 architecture and also supports PCI Express graphics.
Fast communications are possible courtesy of a Gigabit Ethernet port.
The COMe-bCD2 supports 5 PCI Express x1 Lanes and PCI Express cards as well as established hardware
solutions based on current buses such as 32-bit PCI. A Gigabit Ethernet port provides fast connectivity to
LAN/WAN and 8 USB 2.0 ports provide fast and sufficient interfaces for external peripherals.
COMe-bCD2 modules also provide the following interfaces that are always located in the same physical
position on each board:
PCI-express, PCI32, USB, serial ATA (SATA), parallel ATA (PATA), LVDS Multi Media ports, as well as an
ACPI (Advanced Configuration and Power Interface) for optimized power management. Six mounting
holes on the board provide secure mounting to allow the module increased shock and vibration
resistance.