Rockwell Automation 1746-XXXX SLC 500 Digital I/O Modules Installation Instructions - Manual (Page 29)

SLC 500 Digital I/O Modules 29
Publication 1746-IN027D-EN-P - December 2012
Specifications
Heat Dissipation
The following tables contain values for the heat dissipated by each I/O module. Use them to
calculate the total amount of heat dissipated by your SLC 500 control system. For details on how
to calculate total heat dissipation, refer to the SLC 500 Modular Hardware Style User Manual,
publication
1747-UM011 . Please note the following definitions:
• Watts per point – the heat dissipation that can occur in each field wiring point when
energized at nominal voltage.
• Minimum Watts – the amount of heat dissipation that can occur when there is no field
power present.
• Total Watts – the Watts per point multiplied by the number of points, plus the
minimum Watts (with all points energized).
General Specifications
Attribute Value
Temperature, operating 0...60 °C (32...140 °F)
(3)
(3)
Temperature is for air surrounding the SLC 500 system. Temperature range exceptions are indicated with certain modules.
Temperature, nonoperating -40...85 °C (-40...185 °F)
Operating humidity 5...95% (noncondensing)
Noise immunity NEMA standard ICS 2-230
Vibration, operating Displacement 0.015 in. peak @ 5...57 Hz
Acceleration 2.5 g @ 57...2000 Hz
Shock, operating 30 g (all modules except relay contact)
10 g (relay contact modules: 1746-OWx, 1746-OX8, and combination I/O modules)
Isolation
(1)
(1) Electro-optical isolation between I/O terminals and control logic.
1500V
Agency certification UL listed
CSA certified or C-UL approved as indicated by product marking
CE compliant for all applicable directives when product or packaging is marked
C-Tick marked for all applicable acts
Hazardous environment class
(2)
(2)
Some modules are classified Class 1, Division 2 by CSA only or C-UL only as shown in the specification table for the respective module.
Class I, Division 2 Hazardous Environment
UL-A196, CSA, C-UL