Rockwell Automation 1771-IXE Installation Instructions - Manual (Page 3)

Thermocouple/Millivolt Input Module 3
Publication 1771Ć5.64 - October 1998
The module receives its power through the 1771 I/O power supply
and requires 850mA from the backplane.
Add this current to the requirements of all other modules in the I/O
chassis to prevent overloading the chassis backplane and/or
backplane power supply.
!
ATTENTION: Do not insert or remove modules from
the I/O chassis while system power is ON. Failure to
observe this rule could result in damage to module
circuitry.
Place your module in any I/O module slot of the I/O chassis except
for the extreme left slot. This slot is reserved for PC processors or
adapter modules.
Group your modules to minimize adverse affects from radiated
electrical noise and heat. We recommend the following.
•
Group analog input and low voltage dc modules away from ac
modules or high voltage dc modules to minimize electrical noise
interference.
•
Do not place this module in the same I/O group with a discrete
high-density I/O module when using 2-slot addressing. This
module uses a byte in both the input and output image tables for
block transfer.
Key the Backplane Connector
Place your module in any slot in the chassis
except the leftmost slot which is reserved for
processors or adapters.
ATTENTION: Observe the
following precautions when
inserting or removing keys:
•
insert or remove keys with
your fingers
•
make sure that key placement
is correct
Incorrect keying or the use of a tool
can result in damage to the
backplane connector and possible
system faults.
!
Position the keying bands in the backplane connectors to correspond to
the key slots on the module.
Place the keying bands:
between 20 and 22
between 24 and 26
You can change the position of these
bands if subsequent systemdesign and
rewiring makes insertion of a different type
of module necessary.
Upper Connector
11022ĆI
I/O chassis
Calculate Power
Requirements
Determine Module
Placement in the I/O
Chassis