AMD 1207 - Manual (Page 53)

Appendix C Keep-Out Drawings for Custom 2U-4P Systems Based on the
Socket F (1207) Processor
53
Thermal Design Guide for Socket F (1207) Processors 32800 Rev. 3.00 August 2006
Appendix C Keep-Out Drawings for Custom 2U-
4P Systems Based on the Socket F
(1207) Processor
Appendix C contains detailed recommended keep out drawings for processor heat sink and mounting
hardware for a 2U-4P system based on the socket F (1207) processor. Depending on the system
features and layout, more space around the processor may be available for the thermal solution than is
shown in these drawings. This space permits the design of heat sinks with better thermal
performance.
Note: These keep-outs are defined for custom rack mount equipment to optimize thermal and
acoustic performance in these systems. These keep-outs are not compliant with AMD
Processor-In-a-Box (PIB) thermal solutions.