AMD 1207 - Manual (Page 37)

Appendix A Keep-Out Drawings for Platforms Using the PIB Thermal
Solution for Socket F (1207) Processors
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Thermal Design Guide for Socket F (1207) Processors 32800 Rev. 3.00 August 2006
Appendix A Keep-Out Drawings for Platforms
Using the PIB Thermal Solution for
Socket F (1207) Processors
Appendix A contains detailed recommended keep-out drawings for processor heat sink and mounting
hardware for platforms using socket F (1207) Processor-In-a-Box (PIB) processors. Depending on the
system features and layout, more space around the processor may be available for the thermal
solution than is shown in these drawings. This space permits the design of heat sinks with better
thermal performance.