1 backplate assembly, Backplate assembly, Figure 9 – AMD 1207 User Manual
Page 32
32
Thermal Design of Custom 2U-4P Systems
Chapter 5
32800
Rev. 3.00
August 2006
Thermal Design Guide for Socket F (1207) Processors
Figure 9.
Exploded View of Thermal Solution for Custom 2U-4P System Based on Socket F
(1207) Processors
The following sections describe the mechanical requirements of the components shown in Figure 9.
5.3.1
Backplate Assembly
For details on the backplate assembly, see section 3.3.1 on page 18.
Note: The backplate for this custom design has a mounting-hole pitch of 4.1 inches.
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