AMD 1207 - Manual (Page 18)

18 Thermal Design of Platforms Using the AMD Processor-In-a-
Box (PIB) Thermal Solution
Chapter 3
32800 Rev. 3.02 August 2006 Thermal Design Guide for Socket F (1207) Processors
Figure 3. Exploded View of Thermal Solution AMD PIB Platforms based on Socket F (1207)
Processors
3.3.1 Backplate Assembly
The backplate is mounted on the backside of the motherboard and enhances local stiffness to support
shock and vibration loads acting on the heat sink. The backplate assembly prevents excessive
motherboard warpage in the area near the processor. Without a backplate, excessive warpage could
cause serious damage to electrical connections of the processor socket and integrated circuit packages
surrounding the processor. The backplate also serves as a stiffener plate for the LGA socket.
The reference backplate is made from a 1/16-inch, hard-milled steel, has an overall thickness of 0.138
inch (3.5 mm), including stiffening ribs, and has a mounting-hole pitch of 3.5 inches. To
accommodate the capacitors on the backside of the board, there is a square hole in the center of the
backplate.