AMD 1207 - Manual (Page 22)

22 Thermal Design of Custom 1U-2P Systems Chapter 4
32800 Rev. 3.02 August 2006 Thermal Design Guide for Socket F (1207) Processors
Depending on the system features and layout, more space around the socket may be available for the
thermal solution than is shown in Figure 4 on page 21. This space permits heat sink designs with
better thermal performance.
Appendix B on page 45 shows a complete, detailed set of keep-out drawings for custom 1U-2P
systems based on socket F (1207) processors.
4.2 Thermal Solution Design Requirements
To maintain the case temperature of the processor below the maximum specification, certain heat sink
design parameters must be considered. Table 4 provides the design-target specifications that must be
met for socket F (1207) processors to operate reliably.
4.3 Sample Heat Sinks and Attachment Methods
The following sections provide one possible thermal design solution and the specifics on attaching
that solution to the motherboard.
Table 5 on page 23 lists the parts used in the thermal reference design solution for 1U-2P systems
based on socket F (1207) processors.
Table 4. Thermal Solution Design Requirements for Custom 1U-2P Systems
Symbol Description Maximum
L Length of heat sink 87 mm
W Width of heat sink 74 mm
H Height of heat sink 28 mm
θ
ca
Case-to-ambient thermal
resistance
0.26°C/W
1, 2, 3
M
HS
Mass of heat sink 450 g to 700 g
F
clip
Clip force 75 lbs ±15 lbs
T
A
Local air temperature entering
processor heat sink
38°C
Notes:
1. This is the thermal resistance required for dual core, 90-nm socket F (1207) processors. The thermal resistance
requirement may vary depending on the product OPN. The user should consult the processor data sheet for the
thermal requirements specific to the part.
2. Heat sinks weighing up to 450 g can be attached to the motherboard. Heat sinks weighing over 450 g should be tied
directly to the chassis for more reliable shock and vibration performance.
3. This chapter describes a heat sink weighing less than or equal to 450 g.