AMD 1207 - Manual (Page 15)

Chapter 3 Thermal Design of Platforms Using the AMD Processor-In-a-
Box (PIB) Thermal Solution
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Thermal Design Guide for Socket F (1207) Processors 32800 Rev. 3.00 August 2006
Chapter 3 Thermal Design of Platforms Using
the AMD Processor-In-a-Box (PIB)
Thermal Solution
This chapter describes the motherboard component height restrictions, thermal-solution design
requirements, sample heat sinks, and attachment methods for platforms using the AMD Processor-In-
a-Box (PIB) thermal solution for socket F (1207) processors.
3.1 Motherboard Component Height Restrictions
The mounting solution for the heat sink calls for a standard motherboard keep-out region and
mounting holes for the processor. Figure 2 shows an overview of the motherboard component height
restrictions for platforms using the PIB thermal solution for socket F (1207) processors.
Figure 2. Motherboard Component Height Restrictions for Platforms Using the AMD PIB
Thermal Solution