AMD 1207 - Manual (Page 21)

Chapter 4 Thermal Design of Custom 1U-2P Systems 21
Thermal Design Guide for Socket F (1207) Processors 32800 Rev. 3.02 3.00 August 2006
Chapter 4 Thermal Design of Custom 1U-2P
Systems
This chapter describes the motherboard component-height restrictions, thermal-solution design
requirements, sample heat sinks, and attachment methods for custom 1U-2P systems based on socket
F (1207) processors.
Note: These keep-outs are defined for custom rack mount equipment to optimize thermal and
acoustic performance in these systems. These keep-outs are not compliant with AMD
Processor-In-a-Box (PIB) thermal solutions.
4.1 Motherboard Component Height Restrictions
The mounting solution for the heat sink calls for a standard motherboard keep-out region and
mounting holes for the processor. Figure 4 shows an overview of the motherboard component height
restrictions for custom 1U-2P systems based on the thermal solution for socket F (1207) processors.
Figure 4. Motherboard Component Height Restrictions for Custom 1U-2P Systems