Adsp-2183, Rev. 0 –18– ( c × v, F ) is calculated for each output – Analog Devices ADSP-2181 User Manual
Page 18: Total power dissipation for this example is p, 7 mw, Figure 16. power vs. frequency, Pd × θ, Thermal resistance (case-to-ambient) θ, Thermal resistance (junction-to-ambient) θ, Thermal resistance (junction-to-case) package θ
ADSP-2181/ADSP-2183
REV. 0
–18–
(C
×
V
DD
2
×
f ) is calculated for each output:
# of
Pins
×
C
×
V
DD
2
×
f
Address, DMS
8
×
10 pF
×
3.3
2
V
×
33.3 MHz
=
29.0 mW
Data Output, WR 9
×
10 pF
×
3.3
2
V
×
16.67 MHz =
16.3 mW
RD
1
×
10 pF
×
3.3
2
V
×
16.67 MHz =
1.8 mW
CLKOUT
1
×
10 pF
×
3.3
2
V
×
33.3 MHz
=
3.6 mW
50.7 mW
Total power dissipation for this example is P
INT
+ 50.7 mW.
1/t
CK
– MHz
POWER (P
INT
) – mW
200
160
130
22
28
23
24
25
26
27
190
170
150
140
180
120
110
100
POWER, INTERNAL
1,4
V
DD
= 3.6V
V
DD
= 3.3V
V
DD
= 3.0V
195mW
160mW
125mW
175mW
140mW
110mW
29
30
31
1/t
CK
– MHz
34
24
18
22
28
23
24
25
26
27
32
26
22
20
30
28
16
14
12
10
POWER (P
IDLE
) – mW
POWER, IDLE
1,2
V
DD
= 3.6V
V
DD
= 3.3V
V
DD
= 3.0V
33mW
27mW
21mW
27mW
21mW
17mW
29
30
31
1/t
CK
– MHz
30
20
14
26
22
23
24
25
28
22
18
16
26
24
12
10
8
6
POWER, IDLE
n MODES
3
27mW
13mW
12mW
21mW
12mW
11mW
27
28
29
30
IDLE
IDLE
(16)
IDLE
(128)
POWER (P
IDLE
n
) – mW
31
VALID FOR ALL TEMPERATURE GRADES.
1
POWER REFLECTS DEVICE OPERATING WITH NO OUTPUT LOADS.
2
IDLE REFERS TO ADSP-2183 STATE OF OPERATION DURING EXECUTION OF IDLE
INSTRUCTION. DEASSERTED PINS ARE DRIVEN TO EITHER V
DD
OR GND.
3
TYPICAL POWER DISSIPATION AT 3.3V V
DD
DURING EXECUTION OF IDLE
n
INSTRUCTION (CLOCK FREQUENCY REDUCTION).
4
I
DD
MEASUREMENT TAKEN WITH ALL INSTRUCTIONS EXECUTING FROM INTERNAL
MEMORY. 50% OF THE INSTRUCTIONS ARE MULTIFUNCTION (TYPES 1,4,5,12,13,14),
30% ARE TYPE 2 AND TYPE 6, AND 20% ARE IDLE INSTRUCTIONS.
Figure 16. Power vs. Frequency
ADSP-2183
ENVIRONMENTAL CONDITIONS
Ambient Temperature Rating:
T
AMB
= T
CASE
– (PD
×
θ
CA
)
T
CASE
= Case Temperature in
°
C
PD = Power Dissipation in W
θ
CA
= Thermal Resistance (Case-to-Ambient)
θ
JA
= Thermal Resistance (Junction-to-Ambient)
θ
JC
= Thermal Resistance (Junction-to-Case)
Package
θ
JA
θ
JC
θ
CA
TQFP
50
°
C/W
2
°
C/W
48
°
C/W
PQFP
41
°
C/W
10
°
C/W
31
°
C/W
TEMPERATURE –
°
C
CURRENT (LOG SCALE) – µA
1000
100
0
–5
85
25
55
10
NOTES:
1. REFLECTS ADSP-2183 OPERATION IN LOWEST POWER MODE.
(SEE "SYSTEM INTERFACE" CHAPTER OF THE ADSP-2100 FAMILY
USER'S MANUAL FOR DETAILS.)
2. CURRENT REFLECTS DEVICE OPERATING WITH NO OUTPUT LOADS.
V
DD
= 3.6V
V
DD
= 3.3V
V
DD
= 3.0V
Figure 15. Power-Down Supply Current (Typical)
POWER DISSIPATION
To determine total power dissipation in a specific application,
the following equation should be applied for each output:
C
×
V
DD
2
×
f
C = load capacitance, f = output switching frequency.
Example:
In an application where external data memory is used and no
other outputs are active, power dissipation is calculated as
follows:
Assumptions:
•
External data memory is accessed every cycle with 50% of the
address pins switching.
•
External data memory writes occur every other cycle with
50% of the data pins switching.
•
Each address and data pin has a 10 pF total load at the pin.
•
The application operates at V
DD
= 3.3 V and t
CK
= 34.7 ns.
Total Power Dissipation = P
INT
+ (C
×
V
DD
2
×
f )
P
INT
= internal power dissipation from Power vs. Frequency
graph (Figure 16).