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Micromod RetroPAK: MOD 30 Installation Manual User Manual

Page 24

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MOD 30ML Replacement for MOD 30 Instruments

REPLACEMENT PROCEDURE

3.3

INSTALLING MODULES

The I/O modules mount on the carrier board, and the optional memory module mounts on
the processor board as shown in Figure 1-1. The I/O modules must be installed before
placing the controller into operation.

Each I/O module must be installed in a location which receives or transmits the
appropriate MOD 30 signal. The following procedure is based on the assumption that the
number of modules, the module types, and the location of each module has been
determined as described in Section 2.

*

NOTE:

If a MOD 30 controller is being replaced by the MOD 30ML Replacement
Instrument with factory installed I/O (Catalog No. 1800R Z___2_A), this
procedure is not required. Proceed to Section 3.4.

Install the modules as follows:

1.

Loosen the 2 retaining screws in the front panel, Figure 1-1, and pull the
instrument out of its housing.

! CAUTION

Support the instrument from the front and bottom or from the insulator
plate whenever the instrument is outside its housing. Do not allow the full
weight of the circuit boards to be suspended unsupported from the front
panel as this may overstress the brackets at that end.

2.

Place the instrument on a flat surface with the front panel overhanging the
edge of the surface so that the black insulator plate is firmly supported. This
positioning assures that the instrument is not damaged by the force applied
when inserting I/O modules.

3.

Plug each I/O module into its required location on the carrier board and
tighten the retaining screw.

4.

If the optional memory module is being used, it can be plugged into the
location provided on the CPU board.

5.

If ICN or RS-232 communication is to be used, go to Section 3.4, otherwise
continue with Step 6.

6.

Insert the instrument into its housing and tighten the screws to draw the front
panel tight against the housing.

3.4

SETTING UP COMMUNICATIONS

Use this procedure to make the required communications available. See Section 2.2.1 for
detailed information about communication options.

1.

If the instrument is in its housing, loosen the 2 retaining screws in the front panel,
Figure 1-1, and pull the instrument out of the housing.

2.

If a 2030N ICN Communications module is required, install the module in locations S7
and S8 using the procedure described in Section 3.3

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