GE Industrial Solutions FNW700R Series - Manual (Page 11)

Data Sheet
October 24, 2011 FNW700R Power Modules; DC-DC Converters
36 – 75 Vdc Input; 28Vdc Output; 700W Output
LINEAGE POWER 11
Layout Considerations
The FNW700R power module series are aluminum
base board packaged style, as such; component
clearance between the bottom of the power module
and the mounting (Host) board is limited. Avoid placing
copper areas on the outer layer directly underneath the
power module.
Through-Hole Lead-Free Soldering
Information
The RoHS-compliant, Z version, through-hole products
use the SAC (Sn/Ag/Cu) Pb-free solder and RoHS-
compliant components. The non-Z version products
use lead-tin (Pb/Sn) solder and RoHS-compliant
components. Both version modules are designed to be
processed through single or dual wave soldering
machines. The pins have an RoHS-compliant, pure tin
finish that is compatible with both Pb and Pb-free wave
soldering processes. A maximum preheat rate of 3
C/s
is suggested. The wave preheat process should be
such that the temperature of the power module board is
kept below 210
C. For Pb solder, the recommended
pot temperature is 260 C, while the Pb-free solder pot
is 270 C max. Not all RoHS-compliant through-hole
products can be processed with paste-through-hole Pb
or Pb-free reflow process. If additional information is
needed, please consult with your Lineage Power
representative for more details.
Post Solder Cleaning and Drying
Considerations
Post solder cleaning is usually the final circuit-board
assembly process prior to electrical board testing. The
result of inadequate cleaning and drying can affect both
the reliability of a power module and the testability of
the finished circuit-board assembly. For guidance on
appropriate soldering, cleaning and drying procedures,
refer to Lineage Power Board Mounted Power
Modules: Soldering and Cleaning
Application Note.