GE Industrial Solutions Austin Lynx II SIP - Manual (Page 16)

Data Sheet
October 2, 2009 Austin Lynx TM II SIP Non-isolated Power Modules:
2.4 – 5.5Vdc input; 0.75Vdc to 3.63Vdc Output; 10A output current
LINEAGE POWER 16
Post solder Cleaning and Drying
Considerations
Post solder cleaning is usually the final circuit-board
assembly process prior to electrical board testing. The
result of inadequate cleaning and drying can affect both
the reliability of a power module and the testability of the
finished circuit-board assembly. For guidance on
appropriate soldering, cleaning and drying procedures,
refer to Board Mounted Power Modules: Soldering and
Cleaning Application Note.
Through-Hole Lead-Free Soldering
Information
The RoHS-compliant through-hole products use the
SAC (Sn/Ag/Cu) Pb-free solder and RoHS-compliant
components. They are designed to be processed
through single or dual wave soldering machines. The
pins have an RoHS-compliant finish that is compatible
with both Pb and Pb-free wave soldering processes. A
maximum preheat rate of 3
°C/s is suggested. The wave
preheat process should be such that the temperature of
the power module board is kept below 210
°C. For Pb
solder, the recommended pot temperature is 260 °C,
while the Pb-free solder pot is 270 °C max. Not all
RoHS-compliant through-hole products can be
processed with paste-through-hole Pb or Pb-free reflow
process. If additional information is needed, please
consult with your Lineage Power technical
representative for more details.