Rainbow Electronics W25X64 User Manual
Page 2
W25X16, W25X32, W25X64
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Table of Contents-
1.
GENERAL DESCRIPTION ......................................................................................................... 4
2.
FEATURES ................................................................................................................................. 4
3.
PIN CONFIGURATION SOIC 208-MIL....................................................................................... 5
4.
PIN CONFIGURATION WSON 6X5-MM .................................................................................... 5
5.
PIN CONFIGURATION PDIP 300-MIL ....................................................................................... 6
6.
PIN DESCRIPTION SOIC 208-MIL, PDIP 300-MIL, AND WSON 6X5-MM ............................... 6
7.
PIN CONFIGURATION SOIC 300-MIL....................................................................................... 7
8.
PIN DESCRIPTION SOIC 300-MIL ............................................................................................ 7
8.1
Package Types ............................................................................................................... 8
8.2
Chip Select (/CS) ............................................................................................................ 8
8.3
Serial Data Output (DO) ................................................................................................. 8
8.4
Write Protect (/WP)......................................................................................................... 8
8.5
HOLD (/HOLD) ............................................................................................................... 8
8.6
Serial Clock (CLK) .......................................................................................................... 8
8.7
Serial Data Input / Output (DIO) ..................................................................................... 8
9.
BLOCK DIAGRAM ...................................................................................................................... 9
10.
FUNCTIONAL DESCRIPTION ................................................................................................. 10
10.1
SPI OPERATIONS ....................................................................................................... 10
10.1.1
SPI Modes ....................................................................................................................10
10.1.2
Dual Output SPI............................................................................................................10
10.1.3
Hold Function ...............................................................................................................10
10.2
WRITE PROTECTION.................................................................................................. 11
10.2.1
Write Protect Features..................................................................................................11
11.
CONTROL AND STATUS REGISTERS................................................................................... 12
11.1
STATUS REGISTER .................................................................................................... 12
11.1.1
BUSY............................................................................................................................12
11.1.2
Write Enable Latch (WEL) ............................................................................................12
11.1.3
Block Protect Bits (BP2, BP1, BP0)..............................................................................12
11.1.4
Top/Bottom Block Protect (TB) .....................................................................................12
11.1.5
Reserved Bits ...............................................................................................................12
11.1.6
Status Register Protect (SRP) ......................................................................................13
11.1.7
Status Register Memory Protection ..............................................................................14
11.2
INSTRUCTIONS ........................................................................................................... 16
11.2.1
Manufacturer and Device Identification.........................................................................16
11.2.2
Instruction Set
(1)
...........................................................................................................17
11.2.3
Write Disable (04h) .......................................................................................................18