Rainbow Electronics W2465 - Manual (Page 8)

W2465
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BONDING PAD DIAGRAM
1 2 3 4 5
6
7
8 9 10 11 12 14 15 16 17
20
22 23 24 25 26
X
Y
A12 A7 A6 A5 A4
A3
A2
A1 A0 O0 O1 O2 O4 O5 O6
19
O7 CS1
A10
OE
A11 A9 A8 CS2
WE
V SS
V SS
V DD
27S-1 27S-2
21
V DD
18
13S-1
13S-2
03
PAD NO. X Y
1 -226.95 1526.15
2 -350.95 1526.15
3 -484.10 1526.15
4 -608.10 1526.15
5 -739.75 1526.15
6 -741.75 1315.10
7 -741.75 -1231.85
8 -741.75 -1456.30
9 -610.60 -1456.30
10 -481.50 -1466.30
11 -343.80 -1466.30
12 -206.10 -1466.30
13S-1 -73.00 -1401.10
13S-2 -8.35 -1212.80
14 60.10 -1466.30
15 193.30 -1466.30
16 332.40 -1466.30
17 465.60 -1466.30
18 603.30 -1466.30
19 738.15 -1456.30
20 740.15 -1221.45
21 740.15 1310.80
22 738.15 1526.15
23 606.50 1526.15
24 482.50 1526.15
25 349.35 1526.15
26 225.35 1526.15
27S-1 94.20 1526.15
27S-2 -50.40 1456.10
Note: For bare chip form (C.O.B.) applications, the substrate must be connected to V DD or left floating in the PCB layout.