Motorola TMS320C6711D User Manual
Page 38
TMS320C6711D
FLOATINGĆPOINT DIGITAL SIGNAL PROCESSOR
SPRS292A − OCTOBER 2005 − REVISED NOVEMBER 2005
38
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•
HOUSTON, TEXAS 77251−1443
device and development-support tool nomenclature (continued)
PREFIX
DEVICE SPEED RANGE
TMS 320
C 6711D GDP
250
TMX = Experimental device
TMP = Prototype device
TMS = Qualified device
SMJ = MIL-PRF-38535, QML
SM = High Rel (non-38535)
DEVICE FAMILY
32 or 320 =
TMS320
DSP family
TECHNOLOGY
PACKAGE TYPE†‡§
C = CMOS
DEVICE
† BGA =
Ball Grid Array
‡ The ZDP mechanical package designator represents the version of the GDP with Pb−Free soldered balls. The ZDP package devices
are supported in the same speed grades as the GDP package devices (available upon request).
§ For actual device part numbers (P/Ns) and ordering information, see the Mechanical Data section of this document or the
TI website (www.ti.com).
TEMPERATURE RANGE (DEFAULT: 0
°
C TO 90
°
C)
( )
Blank = 0
°
C to 90
°
C, commercial temperature
A
= −40
°
C to 105
°
C, extended temperature
167 MHz
200 MHz
250 MHz
GDP = 272-pin plastic BGA
ZDP = 272-pin plastic BGA, with Pb-free soldered balls
C6711D
Figure 5. TMS320C6711D DSP Device Nomenclature
MicroStar BGA and PowerPAD are trademarks of Texas Instruments.