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Capacitance, Thermal resistance, Ac test loads and waveforms – Cypress CY7C1345G User Manual

Page 11

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CY7C1345G

Document Number: 38-05517 Rev. *E

Page 11 of 20

Capacitance

Tested initially and after any design or process change that may affect these parameters.

Parameter

Description

Test Conditions

100 TQFP

Max

119 BGA

Max

Unit

C

IN

Input Capacitance

T

A

= 25

°C, f = 1 MHz,

V

DD

= 3.3V.

V

DDQ

= 3.3V

5

5

pF

C

CLK

Clock Input Capacitance

5

5

pF

C

IO

Input or Output Capacitance

5

7

pF

Thermal Resistance

Tested initially and after any design or process change that may affect these parameters.

Parameter

Description

Test Conditions

100 TQFP

Package

119 BGA

Package

Unit

Θ

JA

Thermal Resistance

(Junction to Ambient)

Test conditions follow

standard test methods and

procedures for measuring

thermal impedance, per

EIA/JESD51.

30.32

34.1

°C/W

Θ

JC

Thermal

Resistance

(Junction to Case)

6.85

14.0

°C/W

AC Test Loads and Waveforms

OUTPUT

R = 317

R = 351

5 pF

INCLUDING

JIG AND

SCOPE

(a)

(b)

OUTPUT

R

L

= 50

Z

0

= 50

V

T

= 1.5V

3.3V

ALL INPUT PULSES

V

DDQ

GND

90%

10%

90%

10%

≤ 1ns

≤ 1ns

(c)

OUTPUT

R = 1667

R = 1538

5 pF

INCLUDING

JIG AND

SCOPE

(a)

(b)

OUTPUT

R

L

= 50

Z

0

= 50

V

T

= 1.25V

2.5V

ALL INPUT PULSES

V

DDQ

GND

90%

10%

90%

10%

≤ 1 ns

≤ 1 ns

(c)

3.3V I/O Test Load

2.5V I/O Test Load