Compaq SmartCore Express SMA200 - Manual (Page 3)

DIGITAL-LOGIC AG SMA200 Manual V1.0
3
Table of Contents
1. P REFACE .....................................................................................................................................................4
1.1. Trademarks ..................................................................................................................................... 4
1.2. Disclaimer ....................................................................................................................................... 4
1.3. Environmental Protection Statement ........................................................................................... 4
1.4. Who should use this Product ....................................................................................................... 4
1.5. Recycling Information.................................................................................................................... 5
1.6. Technical Support .......................................................................................................................... 5
1.7. Limited Two Year Warranty ........................................................................................................... 5
1.8. Explanation of Symbols................................................................................................................. 6
1.9. Applicable Documents and Standards ........................................................................................ 7
1.10. For Your Safety............................................................................................................................... 8
1.11. RoHS Commitment......................................................................................................................... 8
1.11.1. RoHS Compatible Product Design .......................................................................................... 9
1.11.2. RoHS Compliant Production Process ..................................................................................... 9
1.11.3. WEEE Application.................................................................................................................... 9
1.12. Swiss Quality ................................................................................................................................ 10
1.13. The Swiss Association for Quality and Management Systems............................................... 10
2. O VERVIEW .................................................................................................................................................11
2.1. Standard Features........................................................................................................................ 11
2.2. Technical Specifications ............................................................................................................. 12
2.3. Examples of Ordering Codes ...................................................................................................... 14
3. D IMENSIONS & D IAGRAMS ..........................................................................................................................15
3.1. Block Diagram .............................................................................................................................. 15
Design IN with the smartModule.............................................................................................................. 16
3.2.
Dimensions of the smartCoreExpress Module ......................................................................... 16
3.3. Connector Placement & Pin Definition on the Carrier Board .................................................. 17
3.4. Photo of the Top Side of the PCB............................................................................................... 18
3.5. Dimensions of the Carrier Board Connector............................................................................. 19
3.6. Component Heights between Module and Carrier Board ........................................................ 19
4. COM-E XPRESS C ONNECTOR D ESCRIPTION ................................................................................................20
4.1. Signal Terminology Descriptions ............................................................................................... 20
4.2. smartCoreExpress Connector Pinout ........................................................................................ 21
5. S IGNAL D ESCRIPTIONS OF THE SMART C ORE E XPRESS .................................................................................23
5.1. Wire Design for Typical Impedances ......................................................................................... 23
5.2. Matching of the Differential Pairs ............................................................................................... 23
5.3. Placing an AC Coupling Capacitor on each PCIe-TX ............................................................... 24
5.4. smartCoreExpress Signal Groups.............................................................................................. 25
5.4.1. PCI-Express........................................................................................................................... 25
5.4.2. SDVO..................................................................................................................................... 26
5.4.3. LVDS ..................................................................................................................................... 27
5.4.4. USB ....................................................................................................................................... 28
5.4.5. Parallel ATA........................................................................................................................... 29
5.4.6. LPC BUS ............................................................................................................................... 30
5.4.7. SMBus ................................................................................................................................... 31
5.4.8. HDA Audio Interface .............................................................................................................. 32
5.4.9. SD / SDIO Interface ............................................................................................................... 33
5.4.10. SPI BUS................................................................................................................................. 34
5.4.11. SATA Interface (Option) ........................................................................................................ 35
5.4.12. GLAN ..................................................................................................................................... 36
5.4.13. CAN / Serial ........................................................................................................................... 37
5.4.14. PM ......................................................................................................................................... 38
5.4.15. Supply.................................................................................................................................... 39
6. SMART C ORE -E XPRESS C ONNECTOR S PECIFICATIONS .................................................................................40
7. SMART C ORE -E XPRESS VERSUS COM EXPRESS ...........................................................................................41
8. I NDEX ........................................................................................................................................................42