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Capacitance, Thermal resistance, Ac test loads and waveforms – Cypress CY7C1338G User Manual

Page 9

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CY7C1338G

Document #: 38-05521 Rev. *D

Page 9 of 17

Capacitance

[10]

Parameter

Description

Test Conditions

100 TQFP

Max.

119 BGA

Max.

Unit

C

IN

Input Capacitance

T

A

= 25°C, f = 1 MHz,

V

DD

= 3.3V.

V

DDQ

= 3.3V

5

5

pF

C

CLK

Clock Input Capacitance

5

5

pF

C

I/O

Input/Output Capacitance

5

7

pF

Thermal Resistance

[10]

Parameter

Description

Test Conditions

100 TQFP

Package

119 BGA
Package

Unit

ΘJA

Thermal Resistance
(Junction to Ambient)

Test conditions follow standard test
methods and procedures for
measuring thermal impedance, per
EIA/JESD51.

30.32

34.1

°C/W

ΘJC Thermal

Resistance

(Junction to Case)

6.85

14.0

°C/W

AC Test Loads and Waveforms

Note:

10. Tested initially and after any design or process change that may affect these parameters.

OUTPUT

R = 317

R = 351

5 pF

INCLUDING

JIG AND

SCOPE

(a)

(b)

OUTPUT

R

L

= 50

Z

0

= 50

V

T

= 1.5V

3.3V

ALL INPUT PULSES

V

DDQ

GND

90%

10%

90%

10%

≤ 1 ns

≤ 1 ns

(c)

OUTPUT

R = 1667

R =1538

5 pF

INCLUDING

JIG AND

SCOPE

(a)

(b)

OUTPUT

R

L

= 50

Z

0

= 50

V

T

= 1.25V

2.5V

ALL INPUT PULSES

V

DDQ

GND

90%

10%

90%

10%

≤ 1ns

≤ 1ns

(c)

3.3V I/O Test Load

2.5V I/O Test Load