ThingMagic Micro Hardware - Manual (Page 39)

This drawing contains information that
is proprietary and confidential to
ThingMagic, Inc, and should not be
used without written permission.
ThingMagic, A Division of Trimble
Four Cambridge Center, 12 th Floor, Cambridge, MA 02142 866-833-4069
M6e-Micro Module Integration
SMT Reflow Profile
SIZE DWG NO REV
A 850-0005-01 X8
SCALE 2:1 SHEET 2 OF 5
REV. DESCRIPTION DATE BY
DRAWN BY
R. Herold
DATE
4/9/12
D
C
B
A
4 3 2 1
D
C
B
A
4 3 2 1
Reflow Solder MUST Be Performed
With Shield Can Facing UP
ONE Reflow Cycle Maximum
01 Initial Release RH
SMT Reflow Profile
Short profiles are recommended for reflow soldering
processes. Peak zone temperature should be adjusted
high enough to ensure proper wetting and optimized
forming of solder joints.
Generally speaking, unnecessary long exposure and
exposure to more than 245C should be avoided.
The profile shown has been used to assemble panelized
boards similar to those on Sheet 4 of this document .
For analyzing and adapting solder profiles a carrier
board was prepared with thermocouples (TC) as
described in the table.
To not overstress the assembly, the complete reflow
profile should be as short as possible. Here an
optimization considering all components on the
application must be performed. The optimization of a
reflow profile is a gradual process. It needs to be
performed for every paste, equipment and product
combination. The presented profiles are only samples
and valid for the used pastes, reflow machines and test
application boards. Therefore a "ready to use"reflow
profile can not be given.