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Capacitance, Thermal resistance, Ac test loads and waveforms – Cypress CY7C1165V18 User Manual

Page 22

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CY7C1161V18, CY7C1176V18
CY7C1163V18, CY7C1165V18

Document Number: 001-06582 Rev. *D

Page 22 of 29

Capacitance

Tested initially and after any design or process change that may affect these parameters.

Parameter

Description

Test Conditions

Max

Unit

C

IN

Input

Capacitance

T

A

= 25

°C, f = 1 MHz,

V

DD

= 1.8V

V

DDQ

= 1.5V

5

pF

C

CLK

Clock Input Capacitance

6

pF

C

O

Output Capacitance

7

pF

Thermal Resistance

Tested initially and after any design or process change that may affect these parameters.

Parameter

Description

Test Conditions

165 FBGA

Package

Unit

Θ

JA

Thermal Resistance
(junction to ambient)

Test conditions follow standard test methods and
procedures for measuring thermal impedance, in
accordance with EIA/JESD51.

17.2

°C/W

Θ

JC

Thermal Resistance
(junction to case)

4.15

°C/W

AC Test Loads and Waveforms

Figure 5. AC Test Loads and Waveforms

1.25V

0.25V

R = 50

Ω

5 pF

INCLUDING

JIG AND

SCOPE

ALL INPUT PULSES

Device

R

L

= 50

Ω

Z

0

= 50

Ω

V

REF

= 0.75V

V

REF

= 0.75V

[23]

0.75V

Under
Test

0.75V

Device
Under
Test

OUTPUT

0.75V

V

REF

V

REF

OUTPUT

ZQ

ZQ

(a)

Slew Rate = 2 V/ns

RQ =
250

Ω

(b)

RQ =
250

Ω

Notes

23. Unless otherwise noted, test conditions are based upon signal transition time of 2V/ns, timing reference levels of 0.75V, Vref = 0.75V, RQ = 250

Ω, V

DDQ

= 1.5V, input

pulse levels of 0.25V to 1.25V, and output loading of the specified I

OL

/I

OH

and load capacitance shown in (a) of AC Test Loads.

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