Rockwell Automation 1771-IXHR , D17716.5.80 HIGH RESOL.THERMOCOUPLE - Manual (Page 12)

Chapter
3
3Ć1
Installing the High Resolution
Thermocouple/Millivolt Input Module
This chapter gives you information on:
calculating the chassis power requirement
choosing the module’s location in the I/O chassis
keying a chassis slot for your module
wiring the input module’s field wiring arm
installing the input module
Before installing your input module in the I/O chassis you must:
Action required: Refer to:
Calculate the power requirements of all modules in each chassis. Power Requirements
Determine where to place the module in the I/O chassis. Module Location in the I/O Chassis
Key the backplane connector in the I/O chassis. Module Keying
Make connections to the wiring arm. Connecting Wiring and Grounding
Electrostatic discharge can damage semiconductor devices inside this module if
you touch backplane connector pins. Guard against electrostatic damage by
observing the following warning:
CAUTION: Electrostatic discharge can degrade performance or
cause permanent damage. Handle the module as stated below.
Wear an approved wrist strap grounding device when handling the module.
Touch a grounded object to rid yourself of electrostatic charge before handling
the module.
Handle the module from the front, away from the backplane connector. Do not
touch backplane connector pins.
Keep the module in its static–shield bag when not in use, or during shipment.
Your module receives its power through the 1771 I/O chassis backplane from
the chassis power supply. The maximum current drawn by the
thermocouple/millivolt input module from this supply is 750mA (3.75 Watts).
Chapter Objectives
Before You Install Your Input
Module
Electrostatic Damage
Power Requirements