Lenze EMF2179IB - Manual (Page 43)

EMF2179IB communication module (DeviceNet)
Installation
Electrical installation
5
5.4
5.4.3

5.4-8 EDSDEN EN 02/2006
General features
Configuration Two shielded symmetrical cables with a common axis and drain wire in
the centre
Total shielding 65% coverage
AWG 36 or min. 0.12 mm tinned braid (individually tinned)
Drain wire Copper 22 min.; min. 19 cores (individually tinned)
Outer diameter 6.096 mm (min.) to 7.112 mm (max.)
Roundness Radius deviation must be within 20% of 0.5 outer diameter
Jacket marking Vendor name & part no. and additional markings
Spec. DC resistor (braid, tape, drain) 10.5 Ohm/1000 m (nominal at 20°C)
Certifications (U.S. and Canada) NEC (UL), CL2 (min.)
Bend radius 20 x diameter (installation) / 7 x diameter (fixed)
Ambient operating temperature -20°C to +70°C at 1.5 Ampere; derate current linearly to zero at 80°C
Storage temperature -40°C to +85°C
Pull tension 289.23 N
max
Features of the data line
Insulation diameter 1.96 mm (nominal)
Conductor pair Copper 24 min.; min. 19 cores (individually tinned)
Colours Light-blue, white
Pair twist / m Approx. 16
Tape shield over conductor pair 1000/1000, Al/Mylar, Al side out, w-shorting fold (pull-on applied)
Impedance 120 Ohm +/- 10% (at 1 MHz)
Propagation delay 4.46 ns/m (max.)
Capacitance between conductors 39.37 pF / m at 1 kHz (nominal)
Capacitance between a condcutor and the
conductor connected to the shield
78.74 pF / m at 1 kHz (nominal)
Capacitive unbalance 3.94 pF/1000 m at 1 kHz (max.)
Spec. DC resistor at 20°C 91.86 Ohm/1000 m (max.)
Attenuation 0.95 dB/100 m at 125 kHz (max.)
1.64 dB/100 m at 500 kHz (max.)
2.30 dB/100 m at 1.00MHz (max.)
Features of the voltage line
Conductor pair Copper 22 min.; min. 19 cores (individually tinned)
Insulation diameter 1.4 mm (nominal)
Colours Red, black
Pair twist / m Approx. 16
Tape shield over conductor pair 1000/1000, Al/Mylar, Al side out, w-shorting fold (pull-on applied)
Spec. DC resistor at 20°C 57.41 Ohm/1000 m (max.)
Features of the “Thin” cable
according to DeviceNet
specifications