Chapter 11: heat dissipation, Drum thermal data, Chapter 11 – ElmoMC Gold Line Digital Servo Drives-Gold Drum Ver 1_400 RJ-45 connectors User Manual
Page 63: Heat dissipation
Gold Drum (RJ-45 Connectors) Installation Guide
MAN-G-DRUM(RJ45)IG-EC (Ver. 1.400)
||Drum Thermal Data
63
Chapter 11:
Heat Dissipation
For full power output capability the Drum is designed to be mounted on an external heat-sink. It is
highly recommended that the “Wall” on which the Drum is mounted will have heat dissipation
capabilities. The Drum at “free air convection” (without an additional heat-sink) can dissipate
around 12 W for 40 °C ambient temperature and not exceeding 80 °C on the heat-sink.
When “Free Air Convection” is sufficient for the application it is recommended to leave
approximately 10 mm of space between the Drum's heat sink and any other assembly.
11.1. Drum Thermal Data
•
Free air convection thermal resistance (θ): Approximately 3.6 to 4 °C/W.
•
Thermal time constant: Approximately 40 minutes/ 2400 seconds (thermal time constant
means that the Drum will reach 2/3 of its final temperature after 4 minutes).
•
Self-heat dissipation capability (no external heat-sink): 12 W for 40 °C/W temperature rise.
•
Shut-off temperature: 86 °C to 88 °C (measured on the heat sink).
•
The thermal resistance when connecting to an external heat sink:
The surface of the external heat-sink is 50 μm: 0.18 °C/W.
Thermal conductive compound. By proper Smearing of the surface a significant
improvement of the thermal resistance is achieved: 0.13 °C/W