GE Industrial Solutions SSTW001A3B Barracuda Series - Manual (Page 9)

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GE
SSTW001
36-75Vdc In
March 26, 2013
Heat Transfe
ncreased airflo
via convection.
current that ca
ambient tempe
3m/s (600 ft./m
Curves section.
Please refer to t
Process For Op
detailed discuss
device tempera
EMC Requir
Figure 17 show
conducted emis
Ref
C1 , C
C4
L
L
Figure 16. Sugg
Figure 17. EMC
For further info
please refer to t
Layout Con
The SSTW powe
used in fine pitc
component clea
module and the
copper areas o
1A3B Ba
nput; 12Vd
r via Convect
ow over the mo
Derating figu
n be delivered
erature (T
A
) for n
min) are shown
the Application
en-Frame Boa
sion of therma
atures.
rements
ws a maximum
ssion limits of E
f Des
C2, C3
4, C5
L1
L2
gested Configu
C signature usi
rmation on des
the FLTR100V1
nsideration
er module serie
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arance betwee
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rracuda
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tion
odule enhance
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by each modu
natural convec
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n Note “Therma
rd-Mounted Po
al aspects inclu
filter configura
EN55022 Class
2
3
4m
10
uration for EN
ing above filte
signing for EMC
10 data sheet (
ns
es are low prof
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en the bottom
ard is limited. A
yer directly und
™ Series
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©2012 General E
s the heat tran
he maximum o
ule versus local
ction and up to
ve Characteris
al Characteriza
ower Modules”
ding maximum
ation to meet th
s B.
Filter
.2uF/100V
33nF Y cap
mH CM choke
uH inductor
55022 Class B
er, SSTWA.
C compliance,
FDS01-043EPS
file in order to b
s. As such,
of the power
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lectric Company
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be
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that
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Note
Figu
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nom
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The
fram
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y. All rights reserv
dule. Also avoid
er module.
additional layo
et.
SSTW family of
ough-Hole (TH)
ough-Hole S
RoHS-complia
(Sn/Ag/Cu) Pb-
ponents. They
le or dual wave
S-compliant fin
wave soldering
/s is suggested
the temperatu
C. For Pb sold
C, while the Pb
e module is also
ering. Refer to
cess details. If a
sult with your G
rface Moun
k and Place
SSTW-SR serie
n-frame constr
embly within a
W-SR series mo
gnetic compone
rface Moun
e: All dimension
re 18. Pick and
ane Height
‘Z’ plane heigh
minal with an RS
zzle Recomme
module weight
me construction
ter Powe
ved.
d placing via in
ut guide-lines,
f power modul
or Surface Mo
Soldering In
nt (Z codes) thr
-free solder an
y are designed
e soldering ma
nish that is com
g processes. A
. The wave pre
ure of the powe
er, the recomm
b-free solder po
o compatible w
the Reflow Sol
additional info
GE representat
nt Informat
s of DC-to-DC
ruction and are
fully automate
odules are desi
ent surface to
nt Informat
ns in mm [in].
d Place Locatio
t of the pick an
SS tolerance of
endations
t has been kep
n. Even so, they
Data Sh
er Modul
nterconnects u
refer to the FL
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unt (SMT) solde
nformation
rough-hole pro
d RoHS-compl
to be processe
achines. The pi
mpatible with b
maximum pre
eheat process
er module boa
mended pot tem
ot is 270C ma
with paste-in-h
dering Informa
rmation is nee
ive for more de
tion
power convert
e designed for
ed manufacturi
igned to use th
allow for pick a
tion (contin
on.
nd place locatio
f +/-0.25 mm.
pt to a minimum
y have a relativ
heet
les
Page
nderneath the
LTR100V10 dat
for either
ering.
oducts use the
iant
ed through
ns have an
both Pb and Pb
eheat rate of
should be such
rd is kept below
mperature is
ax. The Throug
ole reflow
ation section fo
ded, please
etails.
ters use an
surface mount
ing process. Th
he main
and place.
nued)
on is 7.50mm
m by using ope
vely large mas
e 9
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or
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