GE Industrial Solutions FLTR75V05 Filter Module - Manual (Page 12)

12 Lineage Power
Data Sheet
October 2009 75 Vdc Input Maximum, 5 A Maximum
FLTR75V05 Filter Module
Post Solder Cleaning and Drying Consid-
eratrions
Post solder cleaning is usually the final circuit-board
assembly process prior to electrical board testing.The
result of inadequate cleaning and drying can affect
both the reliability of a power module and the testability
of the finished circuit-board assembly.For guidance on
appropriate soldering,cleaning and drying proce-
dures,refer to Lineage Power Board Mounted Power
Modules:Soldering and Cleaning Application Note.
Through-Hole Lead Free Soldering Infor-
mation
The RoHS-compliant through-Hole products use the
SAC(Sn/Ag/Cu) Pb-free solder and RoHS- compliant
components.They are designed to be processed
through single or dual wave soldering machines.The
pins have an RoHS-compliant finish that is compatible
with both Pb and Pb-free wave soldering processes.A
Maximum preheat rate 3
0
C/s is suggested.The wave
preheat process should be such that the temperature
of the power module board is kept below 210
0 C.For Pb
solder,the recommended pot temperature is
260
0
C,while the Pb-free solder pot is 270
0
C max.Not
all RoHS-compliant through-hole products can be pro-
cessed with paste-through-hole Pb or Pb-free reflow
process.If additional information is needed,please con-
sult with your
Lineage Power representative for more details.