GE Industrial Solutions FLT007A0-SRZ - Manual (Page 9)

Data Sheet
July 14, 2010
FLT007A0Z/FLT007A0-SRZ Input Filter Modules
75Vdc Input Voltage Maximum, 7A Output Current Maximum
LINEAGE POWER 9
R
EF
LOW
T
EM
P (
°C)
REFLOW TIME (S)
Figure 13. Reflow Profile for Tin/Lead (Sn/Pb)
process.
M
AX T
EM
P S
OL
D
ER
(
°C)
Figure 14. Time Limit Curve Above 205
o
C Reflow
for Tin Lead (Sn/Pb) process.
Lead Free Soldering
The FLT007A0-SRZ SMT modules are lead-free (Pb-
free) and RoHS compliant and are both forward and
backward compatible in a Pb-free and a SnPb
soldering process. Failure to observe the instructions
below may result in the failure of or cause damage to
the modules and can adversely affect long-term
reliability.
Pb-free Reflow Profile
Power Systems will comply with J-STD-020 Rev. C
(Moisture/Reflow Sensitivity Classification for
Nonhermetic Solid State Surface Mount Devices) for
both Pb-free solder profiles and MSL classification
procedures. This standard provides a recommended
forced-air-convection reflow profile based on the
volume and thickness of the package (table 4-2). The
suggested Pb-free solder paste is Sn/Ag/Cu (SAC).
The recommended linear reflow profile using
Sn/Ag/Cu solder is shown in Figure. 15.
MSL Rating
The FLT007A0-SRZ SMT modules have a MSL rating
of 1.
Storage and Handling
The recommended storage environment and handling
procedures for moisture-sensitive surface mount
packages is detailed in J-STD-033 Rev. A (Handling,
Packing, Shipping and Use of Moisture/Reflow
Sensitive Surface Mount Devices). Moisture barrier
bags (MBB) with desiccant are required for MSL
ratings of 2 or greater. These sealed packages
should not be broken until time of use. Once the
original package is broken, the floor life of the product
at conditions of <= 30°C and 60% relative humidity
varies according to the MSL rating (see J-STD-033A).
The shelf life for dry packed SMT packages will be a
minimum of 12 months from the bag seal date, when
stored at the following conditions: < 40° C, < 90%
relative humidity.
Per J-STD-020 Rev. C
0
50
100
150
200
250
300
Reflow Time (Seconds)
R
ef
lo
w
T
em
p
(
°C
)
Heating Zone
1°C/Second
Peak Temp 260°C
* Min. Time Above 235°C
15 Seconds
*Time Above 217°C
60 Seconds
Cooling
Zone
Figure 15. Recommended linear reflow profile
using Sn/Ag/Cu solder.