Littelfuse SMDJ-HR Series - Manual (Page 5)

Transient Voltage Suppression Diodes
59
TVS Diode Arrays
(SPA ™ Family of Products)
©2013 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 11/18/13
Surface Mount – 3000W > SMDJ-HR series
SMDJ-HR Series
Physical Specifications
Weight 0.007 ounce, 0.21 grams
Case
JEDEC DO214AB. Molded plastic body
over glass passivated junction
Polarity
Color band denotes positive end
(cathode) except Bidirectional.
Terminal
Matte Tin-plated leads, Solderable per
JESD22-B102D
Dimensions
Dimensions
Inches Millimeters
Min Max Min Max
A 0.114 0.126 2.900 3.200
B 0.260 0.280 6.600 7.110
C 0.220 0.245 5.590 6.220
D 0.079 0.103 2.060 2.620
E 0.030 0.060 0.760 1.520
F 0.002 0.008 0.051 0.203
G 0.305 0.320 7.750 8.130
H 0.006 0.012 0.152 0.305
I 0.129 - 3.300 -
J 0.094 - 2.400 -
K - 0.165 4.200
L 0.094 - 2.400 -
Environmental Specifications
Soldering Parameters
Te
mperature (T
)
Time (t)
T
s(min)
T
s(max)
T
L
T
P
t
s
Preheat
t
L
t
p
Ramp-up Critical Zone
T
L to T P
Ramp-down
t 25˚C to Peak
25˚C
Reflow Condition Lead–free assembly
Pre Heat
- Temperature Min (T
s(min)
) 150°C
- Temperature Max (T
s(max)
) 200°C
- Time (min to max) (t
s
) 60 – 180 secs
Average ramp up rate (Liquidus Temp
(T
L
) to peak
3°C/second max
T
S(max)
to T
L
- Ramp-up Rate 3°C/second max
Reflow
- Temperature (T
L
) (Liquidus) 217°C
- Time (min to max) (t
s
) 60 – 150 seconds
Peak Temperature (T
P
) 260 +0/-5 °C
Time within 5°C of actual peak
Temperature (t
p
)
20 – 40 seconds
Ramp-down Rate 6°C/second max
Time 25°C to peak Temperature (T
P
) 8 minutes Max.
Do not exceed 280°C
(all dimensions in mm)
I
L K J
Solder Pads
5
High Temp. Storage JESD22-A103
HTRB JESD22-A108
Thermal Shock JESD22-A106
MSL JEDEC-J-STD-020C, Level 1
H3TRB JESD22-A101
RSH JESD22-B106C
DO-214AB (SMC J-Bend)
B
F
G
H
E
C
D
A
Cathode Band
(for Uni-directional products only)