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Rainbow Electronics MAX106 User Manual

Page 24

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MAX106

±5V, 600Msps, 8-Bit ADC with On-Chip
2.2GHz Bandwidth Track/Hold Amplifier

24

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determining the die temperature is to measure each
current with an ammeter (which shuts off the internal
catch diodes) referenced to GNDI. The die temperature
in °C is then calculated by the expression:

Another method of determining the die temperature
uses the operational amplifier circuit shown in Figure
20. The circuit produces a voltage that is proportional
to the die temperature. A possible application for this
signal is speed control for a cooling fan to maintain
constant MAX106 die temperature. The circuit operates
by converting the I

CONST

and I

PTAT

currents to volt-

ages V

CONST

and V

PTAT

, with appropriate scaling to

account for their equal values at +27°C. This voltage
difference is then amplified by two amplifiers in an
instrumentation-amplifier configuration with adjustable
gain. The nominal value of the circuit gain is 4.5092V/V.
The gain of the instrumentation amplifier is given by the
expression:

To calibrate the circuit, first connect pins 2-3 on JU1 to
zero the input of the PTAT path. With the MAX106 pow-
ered up, adjust potentiometer R3 until the voltage at the
V

TEMP

output is -2.728V. Connecting pins 1-2 on JU1

restores normal operation to the circuit after the calibra-
tion is complete. The voltage at the V

TEMP

node will

then be proportional to the actual MAX106 die tempera-
ture according to the equation:

The overall accuracy of the die temperature measure-
ment using the operational-amplifier scaling circuitry is
limited mainly by the accuracy and matching of the
resistors in the circuit.

Thermal Management

Depending on the application environment for the
ESBGA-packaged MAX106, the customer may have to
apply an external heatsink to the package after board
assembly. Existing open-tooled heatsinks are available
from standard heatsink suppliers (listed in Heatsink
Manufacturers
). The heatsinks are available with preap-
plied adhesive for easy package mounting.

T

( C)

100 V

DIE

TEMP

°

=

A

V

V

V

A

R

R

R

R

V

TEMP

CONST

PTAT

V

=

=

+

+

1

1

2

2

1

3

T

300

I

I

273

DIE

PTAT

CONST

=



 −

V

CONST

V

TEMP

R1

7.5k

R2

15k

R2

15k

3.32k

5k

R1

7.5k

6.65k

6.65k

6.05k

12.1k

12.1k

1

2

3

JU1

10-TURN

I

PTAT

V

PTAT

I

CONST

1/4 MAX479

1/4 MAX479

1/4 MAX479

1/4 MAX479

Figure 20. Die Temperature-Acquisition Circuit with the MAX479