Typical application circuit chip information, Package information – Rainbow Electronics MAX2063 User Manual
Page 21
MAX2063
Dual 50MHz to 1000MHz High-Linearity,
Serial/Parallel-Controlled Digital VGA
21
Typical Application Circuit
Chip Information
PROCESS: SiGe BiCMOS
Package Information
For the latest package outline information and land patterns,
go to
www.maxim-ic.com/packages
. Note that a “+”, “#”, or
“-” in the package code indicates RoHS status only. Package
drawings may show a different suffix character, but the drawing
pertains to the package regardless of RoHS status.
MAX2063
13
14
15
16
17
18
19
20
21
22
23
24
GND
D0_2
D1_2
D2_2
D3_2
D_ATT_OUT_2
D4_2
GND
DA_SP
GND
C9
C7
C15
RF
OUTPUT 1
RF
INPUT 1
RF
INPUT 2
C11
C4
C2
GND
V
CC_AMP_2
V
CC
V
CC
48
47
46
45
DIGITAL
ATTENUATOR
1
44
43
42
41
40
39
38
37
1
2
3
4
5
6
7
8
9
10 11 12
GND
D0_1
D1_1
D2_1
D3_1
D_ATT_OUT_1
D4_1
GND
GND
GND
GND
V
CC_AMP_1
GND
D_ATT_IN_2
STA_A_2
STA_B_2
V
CC_RG
CLK
DAT
STA_B_1
STA_A_1
D_ATT_IN_1
GND
36 35 34 33 32 31 30 29 28 27 26 25
GND
AMP_IN_2
PD_2
GND
AMP_OUT_2
REG_OUT
AMPSET
AMP_OUT_1
GND
PD_1
AMP_IN_1
GND
CS
DIGITAL
ATTENUATOR
2
SPI
ACTIVE
BIAS
ACTIVE
BIAS
AMP
AMP
EXPOSED
PAD
C6
L1
L2
C14
RF
OUTPUT 2
C13
V
CC
V
CC
C8
C16
C1
+
PACKAGE
TYPE
PACKAGE
CODE
OUTLINE
NO.
LAND
PATTERN NO.
48 Thin QFN-EP
T4877+7