Rainbow Electronics MAX2063 - Manual (Page 2)

MAX2063
Dual 50MHz to 1000MHz High-Linearity,
Serial/Parallel-Controlled Digital VGA
2
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
V CC_AMP_1 , V CC_AMP_2 , V CC_RG to GND ..........-0.3V to +5.5V
STA_A_1, STA_A_2, STA_B_1, STA_B_2, PD_1,
PD_2, AMPSET to GND ...................................-0.3V to +3.6V
DAT, CS, CLK, DA_SP to GND ............................-0.3V to +3.6V
D0_1, D1_1, D2_1, D3_1, D4_1, D0_2, D1_2,
D2_2, D3_2, D4_2 to GND ...............................-0.3V to +3.6V
AMP_IN_1, AMP_IN_2 to GND ..........................+0.95V to +1.2V
AMP_OUT_1, AMP_OUT_2 to GND .....................-0.3V to +5.5V
D_ATT_IN_1, D_ATT_IN_2, D_ATT_OUT_1,
D_ATT_OUT_2 to GND ......................................... 0V to +3.6V
REG_OUT .............................................................-0.3V to +3.6V
RF Input Power (D_ATT_IN_1, D_ATT_IN_2) ............... +20dBm
RF Input Power (AMP_IN_1, AMP_IN_2) ...................... +18dBm
q
JC (Notes 1, 2) ......................................................... +12.3NC/W
q
JA (Notes 2, 3) ............................................................ +38NC/W
Continuous Power Dissipation (Note 1) ..............................5.3W
Operating Case Temperature Range (Note 4) .. -40NC to +85NC
Junction Temperature .....................................................+150NC
Storage Temperature Range ............................ -65NC to +150NC
Lead Temperature (soldering, 10s) ................................+300NC
Soldering Temperature (reflow) ......................................+260NC
+5V SUPPLY DC ELECTRICAL CHARACTERISTICS
(Typical Application Circuit, V CC = V CC_AMP_1 = V CC_AMP_2 = V CC_RG = +4.75V to +5.25V, AMPSET = 0, PD_1 = PD_2 = 0, T C =
-40NC to +85NC. Typical values are at V CC_ = +5.0V and T C = +25NC, unless otherwise noted.)
+3.3V SUPPLY DC ELECTRICAL CHARACTERISTICS
(Typical Application Circuit, V CC = V CC_AMP_1 = V CC_AMP_2 = V CC_RG = +3.135V to +3.465V, AMPSET = 1, PD_1 = PD_2 = 0, T C
= -40NC to +85NC. Typical values are at V CC_ = +3.3V and T C = +25NC, unless otherwise noted.)
ABSOLUTE MAXIMUM RATINGS
Note 1: Based on junction temperature T J = T C + (B JC x V CC x I CC ). This formula can be used when the temperature of the
exposed pad is known while the device is soldered down to a PCB. See the Applications Information section for details.
The junction temperature must not exceed +150NC.
Note 2: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-
layer board. For detailed information on package thermal considerations, refer to www.maxim-ic.com/thermal-tutorial .
Note 3: Junction temperature T J = T A + (B JA x V CC x I CC ). This formula can be used when the ambient temperature of the PCB is
known. The junction temperature must not exceed +150NC.
Note 4: T C is the temperature on the exposed pad of the package. T A is the ambient temperature of the device and PCB.
PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS
Supply Voltage V CC 4.75 5 5.25 V
Supply Current I DC 148 205 mA
Power-Down Current I DCPD PD_1 = PD_2 = 1, V IH = 3.3V 5.2 8 mA
Input Low Voltage V IL 0.5 V
Input High Voltage V IH 1.7 3.465 V
Input Logic Current I IH , I IL -1 +1 F A
PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS
Supply Voltage V CC 3.135 3.3 3.465 V
Supply Current I DC 88 145 mA
Power-Down Current I DCPD PD_1 = PD_2 = 1, V IH = 3.3V 4.3 8 mA
Input Low Voltage V IL 0.5 V
Input High Voltage V IH 1.7 3.465 V