Packaging information – Rainbow Electronics AT28C256 User Manual
Page 16

AT28C256
16
Packaging Information
1.49(37.9)
1.44(36.6)
PIN
1
.610(15.5)
.510(13.0)
.098(2.49)
MAX
.005(.127)
MIN
.060(1.52)
.015(.381)
.023(.584)
.014(.356)
.065(1.65)
.045(1.14)
0
15
REF
.700(17.8) MAX
.620(15.7)
.590(15.0)
.015(.381)
.008(.203)
.110(2.79)
.090(2.29)
.200(5.08)
.125(3.18)
SEATING
PLANE
.225(5.72)
MAX
1.300(33.02) REF
PIN #1 ID
.370(9.40)
.250(6.35)
.019(.483)
.015(.381)
.050(1.27) BSC
.045(1.14) MAX
.119(3.02)
.087(2.21)
.045(1.14)
.026(.660)
.286(7.26)
.274(6.96)
.077(1.96)
.043(1.09)
.006(.152)
.004(.102)
.416(10.6)
.384(9.75)
.728(18.5)
.712(18.1)
.045(1.14) X 45˚
PIN NO. 1
IDENTIFY
.025(.635) X 30˚ - 45˚
.012(.305)
.008(.203)
.021(.533)
.013(.330)
.530(13.5)
.490(12.4)
.030(.762)
.015(.381)
.095(2.41)
.060(1.52)
.140(3.56)
.120(3.05)
.032(.813)
.026(.660)
.050(1.27) TYP
.553(14.0)
.547(13.9)
.595(15.1)
.585(14.9)
.300(7.62) REF
.430(10.9)
.390(9.90)
AT CONTACT
POINTS
.022(.559) X 45˚ MAX (3X)
.453(11.5)
.447(11.4)
.495(12.6)
.485(12.3)
28D6, 28-lead, 0.600" Wide, Non-windowed Ceramic
Dual Inline Package (Cerdip)
Dimensions in Inches and (Millimeters)
MIL-STD-1835 D-10 CONFIG A
28F, 28-lead, Non-windowed, Ceramic Bottom-
brazed Flat Package (Flatpack)
Dimensions in Inches and (Millimeters)
MIL-STD-1835 F-12 CONFIG B
32J, 32-lead, Plastic J-leaded Chip Carrier (PLCC)
Dimensions in Inches and (Millimeters)
JEDEC STANDARD MS-016 AE
32L, 32-pad, Non-windowed, Ceramic Leadless Chip
Carrier (LCC)
Dimensions in Inches and (Millimeters)
MIL-STD-1835 C-12