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Pin description, Bit microcontroller with infrared module maxq613, Pin configurations (continued) pin description – Rainbow Electronics MAXQ613 User Manual

Page 9

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16-Bit Microcontroller with Infrared Module

MAXQ613

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Pin Configurations (continued)

Pin Description

TQFP

(10mm × 10mm)

TOP VIEW

12 P1.1/INT1

13 P1.2/INT2

14 P1.3/INT3

15 N.C.

16 N.C.

17 GND

18 REGOUT

19 V

DD

20 GND

21 P1.4/INT4

22 P1.5/INT5

P2.3/SSEL

33

HFXOUT

24

HFXIN

23

P1.6/INT6

25

P1.7/INT7

26

P2.0/MOSI

27

GND

28

P2.1/MISO

29

N.C.

30

N.C.

31

P2.2/SCLK

32

P0.0/IRTXM/INT8

1

N.C.

2

P0.1/RX/INT9

3

N.C.

4

P0.2/TX/INT10

5

P0.3/INT11

6

P0.4/INT12

7

P0.5/TBA0/TBA1/INT13

8

P0.6/TBB0/INT14

9

P1.0/INT0

11

P0.7/TBB1/INT15

10

34

P2.4/TCK

44

IRRX

43

IRTX

NOTE: CONTACT FACTORY FOR BARE DIE PAD CONFIGURATION.

42

GND

41

V

DD

40

RESET

39

P2.7/TDO

38

P2.6/TMS

37

N.C.

36

N.C.

35

P2.5/TDI

MAXQ613

+

PIN

NAME

FUNCTION

BARE DIE

32 TQFN-

EP/LQFP

44 TQFN-

EP/TQFP

POWER PINS

15, 36

15, 29

19, 41

V

DD

Supply Voltage

13, 16, 25,

37

13, 22, 30

17, 20, 28,

42

GND

Ground. Connect directly to the ground plane.

14

14

18

REGOUT

1.8V Regulator Output. This pin must be connected to ground through
a 1.0FF (ESR: 2

W–10W) external ceramic-chip capacitor. The capacitor

must be placed as close to this pin as possible. No devices other than
the capacitor should be connected to this pin.

EP

Exposed Pad (TQFN Only). Connect EP directly to the ground plane.