Rainbow Electronics W24L257 - Manual (Page 8)

Preliminary W24L257
- 8 -
BONDING PAD DIAGRAM
23
X
Y
A14 A12 A7 A6 A5
A3
8 22
A2 A10
OEB
A11 A9 A8 WEB V DD V DD
7
A4 A13
1 2 3 4 5 29 24 25 26 27 6 30 28
11 12 13 15 16 17 18
A0 I/O0 I/O1 I/O2 V SS V SS I/O4 I/O5 I/O6
19 9
A1
10 20
CSB
14 21
I/O7 I/O3
AC5394
PAD NO. X Y
1 -232.25 1445.22
2 -351.70 1445.22
3 -471.15 1445.22
4 -590.60 1445.22
5 -710.05 1445.22
6 -829.50 1445.22
7 -992.79 1362.24
8 -992.79 -1306.11
9 -857.86 -1452.79
10 -738.41 -1452.79
11 -594.84 -1414.13
12 -451.06 -1414.13
13 -310.67 -1414.13
14 -171.78 -1405.28
15 24.45 -1405.28
16 151.80 -1414.13
17 298.07 -1414.13
18 443.28 -1414.13
19 588.20 -1414.13
20 732.84 -1414.13
21 871.11 -1452.79
22 992.75 -1312.15
23 992.75 1373.67
24 810.09 1445.22
25 690.64 1445.22
26 571.19 1445.22
27 451.74 1445.22
28 332.29 1445.22
29 120.25 1444.65
30 -93.23 1444.65
Note: For bare chip form (C.O.B.) applications, the substrate must be connected to V DD or left floating in the PCB layout.