Panasonic ASCT1F46E - Manual (Page 15)

14
Automatic Soldering Hand Soldering
4. Soldering
•
Flow solder is the optimum method for
soldering.
•
Adjust the level of solder so that it does
not overflow onto the top of the PC
board.
•
Unless otherwise specified, solder
under the following conditions
depending on the type of relay.
Solder
Temperature
Approx.260°C±5°C/
500°F±41°F
Soldering Time
Within approx. 6
seconds
• Please take caution with multi-layer
boards. Relay performance may
degrade due to the high thermal
capacity of these boards
• Keep the tip of the soldering iron
clean.
Soldering Iron 30W to 60W
Iron Tip
Temperature
Approx. 350°C
Soldering Time
Within approx. 3
seconds
5. Cooling
•
Immediate air cooling is recommend to prevent deterioration of the relay and
surrounding parts due of soldering heat.
•
Although environmentally the sealed type relay (plastic sealed type, etc.) can be
cleaned, avoid immersing the relay into cold liquid (such as cleaning solvent and
coating material) immediately after soldering. Doing so may deteriorate the sealing
performance.
6. Cleaning
•
Do not clean dust-cover type relays and flux-resistant type relays by immersion.
Even if only the bottom surface of the PC board is cleaned (e.g. with a brush),
careless cleaning may cause cleaning solvent to penetrate the relay.
•
Plastic sealed type relays can be cleaned by immersion. Use an alcohol-based
cleaning solvent. Use of other cleaning solvents (e.g. Trichlene, chloroethene,
thinner, benzyl alcohol, gasoline) may damage the relay case.
•
Cleaning with the boiling method is recommended. Avoid ultrasonic cleaning on
relays. Use of ultrasonic cleaning may cause breaks in the coil or slight sticking of
the contacts due to the ultrasonic energy.
•
Do not cut the terminals. When terminals are cut, breaking of coil wire and slight
sticking of the contacts may occur due to vibration of the cutter.
7. Coating
•
If the PC board is to be coated to prevent the insulation of the PC board from
deteriorating due to corrosive gases and high temperatures, note the following.
•
Do not coat dust-cover type relays and flux-resistant type relays, since the coating
material may penetrate the relay and cause contact failure. Or, mount the relay
after coating.
•
Depending on the type, some coating materials may have an adverse affect on
relays. Furthermore, some solvents (e.g. xylene, toluene, MEK, I.P.A.) may
damage the case or chemically dissolve the epoxy and break the seal. Select
coating materials carefully.
•
If the relay and all components (e.g. ICs) are to be coated, be sure to carefully
check the flexibility of the coating material. The solder may peel off from thermal
stress.
Coating
material type
Suitability
for Relays
Features
Epoxy-base Good
Good electrical insulation.
Although slightly difficult to apply, does not affect
relay contacts.
Urethane-base Care
Good electrical insulation, easy to apply.
Solvent may damage case. Check before use.
Silicon-base No Good
Silicon gas becomes the cause of contact failure.
Do not use the silicon-base type.