Intel CORETM 2 DUO MOBILE 320028-001 - Manual (Page 8)

Intel® Core™ 2 Duo Mobile Processors on 45-nm process for Embedded Applications
June 2008 TDG
Order Number: 320028-001 8
Introduction—Core™ 2 Duo Mobile Processors
1.3 Reference Documents
The reader of this specification should also be familiar with material and concepts presented in the
following documents:
• Intel® Core™2 Duo Processor for Intel® Centrino® Duo Mobile Technology Datasheet
Documents are located at developer.intel.com. Contact your Intel field sales representative for
additional information.
1.4 Thermal Design Tool Availability
Intel provides thermal simulation models of the device and a thermal model user’s guide to aid
system designers in simulating, analyzing, and optimizing thermal solutions in an integrated, system-
level environment. The models are for use with commercially available Computational Fluid Dynamics
(CFD)-based thermal analysis tools including Flotherm* (version 7.1 or higher) by Flomerics, Inc. or
Icepak* by Fluent, Inc. Contact your Intel representative to order the thermal models and associated
user’s guides.
TIM
Thermal Interface Material – the thermally conductive compound between the
heatsink and die. This material fills air gaps and voids, and enhances spreading of
the heat from the die to the heatsink.
U
A unit of measure used to define server rack spacing height. 1U is equal to 1.75
inches, 2U equals 3.50 inches, etc.
W Watt
Table 1. Definition of Terms (Sheet 2 of 2)
Term Definition