Intel CORETM 2 DUO MOBILE 320028-001 - Manual (Page 3)

Core™ 2 Duo Mobile Processors—Contents
Intel® Core™ 2 Duo Mobile Processors on 45-nm process-Thermal Design Guide
TDG June 2008
3 Order Number: 320028-001
Contents
1.0 Introduction ............................................................................................................. 6
1.1
Design Flow ....................................................................................................... 6
1.2 Definition of Terms ............................................................................................. 7
1.3 Reference Documents.......................................................................................... 8
1.4 Thermal Design Tool Availability ........................................................................... 8
2.0 Package Information ................................................................................................ 9
3.0 Thermal Specifications.............................................................................................10
3.1
Thermal Design Power........................................................................................10
3.2 Maximum Allowed Component Temperature ..........................................................10
4.0 Mechanical Specifications ........................................................................................11
4.1
Package Mechanical Requirements .......................................................................11
4.1.1
Die Pressure/Load Upper Limit..................................................................11
4.1.2 Die Pressure/Load Lower Limit..................................................................11
4.2 Package Keep Out Zones Requirements ................................................................11
4.3 Board Level Keep Out Zone Requirements.............................................................11
5.0 Thermal Solution Requirements ...............................................................................15
5.1
Thermal Solution Characterization........................................................................15
5.1.1
Calculating the Required Thermal Performance for the Intel ® Core™2 Duo
processor ..............................................................................................16
6.0 Reference Thermal Solutions ...................................................................................18
6.1
ATCA Reference Thermal Solution ........................................................................18
6.2 Keep Out Zone Requirements ..............................................................................19
6.3 Thermal Performance .........................................................................................19
6.4 1U+ Reference Heatsink .....................................................................................19
6.4.1
Keep Out Zone Requirements ...................................................................20
6.4.2 Thermal Performance ..............................................................................20
6.5 Compact PCI Reference Heatsink .........................................................................21
6.5.1
Keep Out Zone Requirements ...................................................................22
6.5.2 Thermal Performance ..............................................................................22
6.6 Heatsink Fastener Assembly................................................................................22
6.7 Thermal Interface Material (TIM) .........................................................................22
6.8 Heatsink Orientation ..........................................................................................23
7.0 Thermal Metrology...................................................................................................24
7.1
Die Temperature Measurements ..........................................................................24
7.2 Power Simulation Software .................................................................................24
7.3 Additional Thermal Features ................................................................................24
7.4 Local Ambient Temperature Measurement Guidelines..............................................24
7.4.1
Active Heatsink Measurements .................................................................25
7.4.2 Passive Heatsink Measurements................................................................25
8.0 Reliability Guidelines ...............................................................................................28
A Thermal Solution Component Suppliers....................................................................29
B Mechanical Drawings ...............................................................................................30