Intel CORETM 2 DUO MOBILE 320028-001 - Manual (Page 19)

Core™ 2 Duo Mobile Processors—Reference Thermal Solutions
Intel® Core™ 2 Duo Mobile Processors on 45-nm process-Thermal Design Guide
TDG June 2008
19 Order Number: 320028-001
6.2 Keep Out Zone Requirements
The keep out zone requirements on the PCB to use this heatsink are detailed in Appendix B,
“Mechanical Drawings” . Because it extends beyond the footprint of the device, it is critical for the
board designer to allocate space on the board for the heatsink.
6.3 Thermal Performance
The AdvancedTCA reference heatsink is an all copper (C1100) design. The performance of this
heatsink has been tested at flow rates from 10 CFM to 30 CFM. The heatsink is expected to meet the
thermal performance needed when the air flow rate is at least 10 CFM at 40 °C. For an external
ambient of 55°C (ψ
ja
= 1.32 °C/W), this heatsink is expected to be suitable for air flow rates around
15 CFM.
6.4 1U+ Reference Heatsink
The 1U reference thermal solution is shown in Figure 8 . The maximum heatsink height is constrained
to 27 mm. The heatsink uses the fastener assembly (refer to Section 6.6 ) to mount to the PCB.
Detailed drawings of this heatsink are provided in Appendix B, “Mechanical Drawings” .
Figure 7. AdvancedTCA* Heatsink Thermal Performance vs. Volumetric Airflow Rate