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Figure 1. thermal design process, 2 definition of terms, Table 1. definition of terms (sheet 1 of 2) – Intel CORETM 2 DUO MOBILE 320028-001 User Manual

Page 7: Definition of terms, Thermal design process

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Core™ 2 Duo Mobile Processors—Introduction

Intel® Core™ 2 Duo Mobile Processors on 45-nm process-Thermal Design Guide

TDG

June 2008

7

Order Number: 320028-001

1.2

Definition of Terms

Figure 1.

Thermal Design Process

Table 1.

Definition of Terms (Sheet 1 of 2)

Term

Definition

FCPGA

Flip Chip Pin Grid Array. A pin grid array packaging technology where the die is

exposed on the package substrate.

FCBGA

Flip Chip Ball Grid Array. A ball grid array packaging technology where the die is

exposed on the package substrate.

T

JUNCTION-MAX

Maximum allowed component (junction) temperature. Also referred to as T

J-MAX

TDP

Thermal Design Power. Thermal solutions should be designed to dissipate this

target power level.

T

LA

Local ambient temperature. This is the temperature measured inside the chassis,

approximately 1 inch upstream of a component heatsink. Also referred to as T

A

.

Ψ

JA

Junction-to-ambient thermal characterization parameter. A measure of heatsink

thermal performance using the total package power. Defined as (T

JUNCTION

– T

LA

) /

Total Package Power

Ψ

TIM

Thermal interface material thermal characterization parameter. A measure of

thermal interface material performance using total package power. Defined as (T

CASE

– T

JUNCTION

)/ Total Package Power. Also referred to as Ψ

JS.

Ψ

SA

Sink-to-ambient thermal characterization parameter. A measure of heatsink

thermal performance using total package power. Defined as (T

SINK

– T

JUNCTION

)/

Total Package Power.

°C

Degrees in Celsius

CFM

Volumetric airflow rate in cubic feet per minute

in.

Inches

LFM

Airflow velocity in linear feet per minute

PCB

Printed circuit board

T

SINK

Heatsink temperature measured on the underside of the heatsink base.

• Package Level Thermal Models
• Thermal Model User’s Guide

Step 1: Thermal Simulation

• Reference Heatsinks
• Reference Mounting Hardware
• Vendor Contacts

Step 2: Heatsink Design
and Selection

Step 3: Thermal Validation

• Thermal Testing Software
• Thermal Test Vehicle
• User Guides