Intel CORETM 2 DUO MOBILE 320028-001 - Manual (Page 21)

Core™ 2 Duo Mobile Processors—Reference Thermal Solutions
Intel® Core™ 2 Duo Mobile Processors on 45-nm process-Thermal Design Guide
TDG June 2008
21 Order Number: 320028-001
6.5 Compact PCI Reference Heatsink
The cPCI reference thermal solution is shown in Figure 10 . The maximum heatsink height is
constrained to 8.7 mm. The heatsink uses the fastener assembly (refer to Section 6.6 ) to mount to
the PCB. Detailed drawings of this heatsink are provided in Appendix B, “Mechanical Drawings” .
Figure 9. 1U Heatsink Thermal Performance vs. Volumetric Airflow Rate
Figure 10. CompactPCI Reference Heatsink Assembly
1U+ Reference Heatsink Performance
0
0.2
0.4
0.6
0.8
1
1.2
1.4
1.6
0 5 10 15 20 25 30
Volum etric Air Flow Rate (CFM)
PSI
(
C
/W
)
Psi_ja
Psi_sa