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8 heatsink orientation, Heatsink orientation – Intel CORETM 2 DUO MOBILE 320028-001 User Manual

Page 23

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Core™ 2 Duo Mobile Processors—Reference Thermal Solutions

Intel® Core™ 2 Duo Mobile Processors on 45-nm process-Thermal Design Guide

TDG

June 2008

23

Order Number: 320028-001

Thermal interface materials have thermal impedance (resistance) that will increase as the material

degrades over time. It is important for thermal solution designers to take this increase in impedance

into consideration when designing a thermal solution. It is recommended that system integrators

work with TIM suppliers to determine the performance of the desired thermal interface material. If

system integrators wish to maintain maximum thermal solution performance, the TIM could be

replaced during standard maintenance cycles.

The reference thermal solution uses Shin Etsu* G751. Alternative materials can be used at the user’s

discretion. Regardless, the entire heatsink assembly, including the heatsink, and TIM (including attach

method), must be validated together for specific applications.

6.8

Heatsink Orientation

All of the heatsinks were designed to maximize the available space within the volumetric keep out

zone and their respective form factor limitations. These heatsinks must be oriented in a specific

direction relative to the processor keep out zone and airflow. In order to use these designs, the

processor must be placed on the PCB in an orientation so the heatsink fins will be parallel to the

airflow.

Figure 12

illustrates this orientation.

Figure 12.

Heatsink Orientation Relative to Airflow Direction