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0 mechanical specifications, 1 package mechanical requirements, 1 die pressure/load upper limit – Intel CORETM 2 DUO MOBILE 320028-001 User Manual

Page 11: 2 die pressure/load lower limit, 2 package keep out zones requirements, 3 board level keep out zone requirements, Mechanical specifications 4.1, Package mechanical requirements 4.1.1, Die pressure/load upper limit, Die pressure/load lower limit

0 mechanical specifications, 1 package mechanical requirements, 1 die pressure/load upper limit | 2 die pressure/load lower limit, 2 package keep out zones requirements, 3 board level keep out zone requirements, Mechanical specifications 4.1, Package mechanical requirements 4.1.1, Die pressure/load upper limit, Die pressure/load lower limit | Intel CORETM 2 DUO MOBILE 320028-001 User Manual | Page 11 / 42 0 mechanical specifications, 1 package mechanical requirements, 1 die pressure/load upper limit | 2 die pressure/load lower limit, 2 package keep out zones requirements, 3 board level keep out zone requirements, Mechanical specifications 4.1, Package mechanical requirements 4.1.1, Die pressure/load upper limit, Die pressure/load lower limit | Intel CORETM 2 DUO MOBILE 320028-001 User Manual | Page 11 / 42
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