Purdy AND4PGA User Manual
And4pga, Features
Purdy Electronics Corporation • 720 Palomar Avenue • Sunnyvale, CA 94085
Tel: 408.523.8200 • Fax: 408.733.1287 • [email protected]
7/18/07
www.purdyelectronics.com
AND4PGA
Ultra Bright LED Lamps: Type 2
Weight: 2.0 mg
Unit: mm
0.4
±
0.2
1.25
R0.2
2.0
Cathode
Index
Polarity
1.1
0.6
1.4
AND4PGA
GaP Ultra Bright Green Light Emission
Surface Mount Package
Features
• Small package size
• 2.0 (l) x 1.25 (w) x 1.1 (h) size
• Suitable for REFLOW soldering
• Recommended Forward Current: 10 mA
Maximum Ratings (T
a
= 25°C)
Characteristics
Symbol
Rating
Unit
Forward Current
I
F
30
mA
Reverse Voltage
V
R
4
V
Power Dissipation
P
D
62.5
mW
Operating Temperature Range
T
Opr
-30 to 85
°C
Storage Temperature Range
T
Stg
-30to 90
°C
Precaution
Please be careful of the following:
1. Manual soldering: maximum temperature of iron tip: 260°C max.
Soldering time: within 5 sec. per solder-land
Soldering portion of lead: up to 1.6 mm from the body of the device
2. Reflow solder: recommended condition is as follows:
Electro-Optical Characteristics (T
a
= 25°C)
Characteristics
Symbol
Test Condition
Minimum
Typical
Maximum
Unit
Forward Voltage
V
F
I
F
= 20 mA
–
2.1
2.8
V
Reverse Current
I
R
V
R
= 4 V
–
–
100
µA
Luminous Intensity
I
V
I
F
= 20 mA
1.0
2.0
–
mcd
Peak Emission Wavelength
l
P
I
F
= 20 mA
–
555
–
nm
Spectral Line Half Width
∆
λ
I
F
= 20 mA
–
30
–
nm
Dominant Wavelength
λ
d
I
F
= 20 mA
–
550
–
nm
Full Viewing Angle
θ
I
V
= 1/2 Peak
–
140
–
degree
more than 2 min.
230
°C max.
140 - 160
°C
Temperature
10 sec. max.
Time
4
°C/sec.
max.
1.1
1.25
1.1
1.25
Reflow
The following soldering patterns
are recommended for reflow
Product specifications contained herein may be
changed without prior notice. It is therefore
advisable to contact Purdy Electronics before
proceeding with the design of equipment
incorporating this product.
• RoHS Compliant