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Purdy AND4PGA User Manual

And4pga, Features

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Purdy Electronics Corporation • 720 Palomar Avenue • Sunnyvale, CA 94085

Tel: 408.523.8200 • Fax: 408.733.1287 • [email protected]

7/18/07

www.purdyelectronics.com

AND4PGA

Ultra Bright LED Lamps: Type 2

Weight: 2.0 mg

Unit: mm

0.4

±

0.2

1.25

R0.2

2.0

Cathode
Index

Polarity

1.1

0.6

1.4

AND4PGA

GaP Ultra Bright Green Light Emission
Surface Mount Package

Features

• Small package size
• 2.0 (l) x 1.25 (w) x 1.1 (h) size
• Suitable for REFLOW soldering
• Recommended Forward Current: 10 mA

Maximum Ratings (T

a

= 25°C)

Characteristics

Symbol

Rating

Unit

Forward Current

I

F

30

mA

Reverse Voltage

V

R

4

V

Power Dissipation

P

D

62.5

mW

Operating Temperature Range

T

Opr

-30 to 85

°C

Storage Temperature Range

T

Stg

-30to 90

°C

Precaution

Please be careful of the following:
1. Manual soldering: maximum temperature of iron tip: 260°C max.

Soldering time: within 5 sec. per solder-land
Soldering portion of lead: up to 1.6 mm from the body of the device

2. Reflow solder: recommended condition is as follows:

Electro-Optical Characteristics (T

a

= 25°C)

Characteristics

Symbol

Test Condition

Minimum

Typical

Maximum

Unit

Forward Voltage

V

F

I

F

= 20 mA

2.1

2.8

V

Reverse Current

I

R

V

R

= 4 V

100

µA

Luminous Intensity

I

V

I

F

= 20 mA

1.0

2.0

mcd

Peak Emission Wavelength

l

P

I

F

= 20 mA

555

nm

Spectral Line Half Width

λ

I

F

= 20 mA

30

nm

Dominant Wavelength

λ

d

I

F

= 20 mA

550

nm

Full Viewing Angle

θ

I

V

= 1/2 Peak

140

degree

more than 2 min.

230

°C max.

140 - 160

°C

Temperature

10 sec. max.

Time

4

°C/sec.

max.

1.1

1.25

1.1

1.25

Reflow

The following soldering patterns

are recommended for reflow

Product specifications contained herein may be

changed without prior notice. It is therefore

advisable to contact Purdy Electronics before

proceeding with the design of equipment

incorporating this product.

• RoHS Compliant