Lanner LEC-2110 - Manual (Page 18)

18
Hardware Setup
Chapter 4
Embedded and Industrial Computing
Chapter 4:
Hardware Setup
Preparing the Hardware Installation
To access some components and perform certain service
procedures, you must perform the following procedures
first.
WARNING: To reduce the risk of personal injury,
electric shock, or damage to the equipment,
remove the power cord to remove power from
the server. The power switch button does not
completely shut off system power. Portions of the
power supply and some internal circuitry remain
active until AC power is removed.
Unpower the LEC-2110 and remove the power cord. 1.
Turn the device upside down. 2.
Unscrew 6 screws on the bottom chassis. And unscrew 3.
the 3screws from both the front and back panel.
Bent the front panel slightly to lift the cover
4.
Open the cover. 5.
Installing the System Memory
The motherboard supports DDR3 memory to meet the
higher bandwidth requirements of the latest operating
system and applications. It comes with one Double Data
Rate Three (DDR3) Small Outline Dual Inline Memory
Module (DDR3 SO-DIMM) socket.
Align the memory module’s cutout with the SO-DIMM 1.
socket’s notch.
Install the SO-DIMM.
2.
Note:
The system can support memory of DDR3 1.
SO-DIMM DDR3 800 MHz up to 4 GB in
maximum.
To release the memory, bent the latch slightly 2.
outward.
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