Sundance SMT398VP - Manual (Page 4)

TABLE OF CONTENTS
1. SCOPE.................................................................................................................................................................................7
1.1. I NTRODUCTION ............................................................................................................................................................7
1.2. P URPOSE ......................................................................................................................................................................7
1.3. A PPLICABILITY ............................................................................................................................................................7
2. APPLICABLE DOCUMENTS AND REFERENCES ....................................................................................................8
2.1. A PPLICABLE D OCUMENTS ............................................................................................................................................8
2.1.1. External Documents ...............................................................................................................................................8
2.1.2. Internal documents .................................................................................................................................................8
2.1.3. Project Documents .................................................................................................................................................8
2.2. R EFERENCES ................................................................................................................................................................8
2.2.1. External documents ................................................................................................................................................8
2.2.2. Internal documents .................................................................................................................................................8
2.2.3. Project documents ..................................................................................................................................................8
2.3. P RECEDENCE ................................................................................................................................................................8
3. ACRONYMS, ABBREVIATIONS AND DEFINITIONS ............................................................................................10
3.1. A CRONYMS AND A BBREVIATIONS ..............................................................................................................................10
3.2. D EFINITIONS ..............................................................................................................................................................10
4. FEATURES .......................................................................................................................................................................11
4.1. T HE SMT398VP TIM................................................................................................................................................11
4.1.1. SMT398VP Diagram ............................................................................................................................................11
4.1.2. Interface Definition ..............................................................................................................................................12
4.1.3. Major features ......................................................................................................................................................12
4.1.4. Prime Item Characteristics...................................................................................................................................12
4.1.5. Performance .........................................................................................................................................................20
4.1.6. Physical Characteristics.......................................................................................................................................21
5. FOOTPRINT ....................................................................................................................................................................23
5.1. T OP V IEW ..................................................................................................................................................................23
5.2. B OTTOM V IEW ...........................................................................................................................................................24
6. PINOUT.............................................................................................................................................................................25
6.1. FPGA ........................................................................................................................................................................25
6.1.1. RSLs......................................................................................................................................................................25
6.2. C ONNECTORS .............................................................................................................................................................27
6.2.1. RSLs......................................................................................................................................................................27
6.3. SHB...........................................................................................................................................................................29
6.4. SLB ...........................................................................................................................................................................29
6.5. JTAG.........................................................................................................................................................................29
6.6. TIM C ONNECTORS .....................................................................................................................................................30
7. ORDERING INFORMATION........................................................................................................................................31
8. QUALIFICATION REQUIREMENTS .........................................................................................................................32
8.1. Q UALIFICATION T ESTS ...............................................................................................................................................32
8.1.1. Meet Sundance standard specifications ...............................................................................................................32
8.1.2. Speed qualification tests .......................................................................................................................................33
8.1.3. Integration qualification tests...............................................................................................................................33
9. HARDWARE SUPPORT PACKAGE............................................................................................................................34
Document No.
S M T 3 9 8 V P - D 0 0 0 0 5 8 H - g u i d e . d o c
Revision
2 . 4 . 2
Date
0 8 / 0 2 / 0 7
Page 4 of 34