beautypg.com

Analog output, Digital i/o, Power distribution – Measurement Computing PCI-DAS4020/12 User Manual

Page 18: Input impedance configuration

background image

PCI-DAS4020/12 User's Guide

Functional Details

18

Analog output

Two 12-bit voltage outputs are software programmable for ±10 V or ±5 V. The D/A is the Analog Devices
AD7237 Dual DAC. Since the DAC is dual buffered, the DAC output voltage is updated after the MS nibble is
written to the DAC.

The DACs initially power-up and are reset to 0 V. There is no calibration on these DACs. The offset and gain
errors are minimized by using precision components. The following table shows the DAC input coding.

DAC input coding

DAC Range

Input Code Binary

12 bit Input Code Hex

12 bit Output Voltage

± 10 V

0000 0000 0000

000h

10.000 V

± 10 V

1000 0000 0000

800h

0 V

± 10 V

1111 1111 1111

FFFh

+9.99513 V

± 5 V

0000 0000 0000

000h

5.000 V

± 5 V

1000 0000 0000

800h

0 V

± 5 V

1111 1111 1111

FFFh

+4.99756 V

Figure 9. Analog output block diagram

Digital I/O

The digital I/O is an 82C55 digital logic device. An external interrupt source pin (pin 1) and external interrupt
enable pin (pin 3) on the auxiliary 40-pin connector (

P3

) are used for external interrupts. These lines are pulled

up and an OR operation is performed on them to generate the external interrupt signal. Both are active low.

Power distribution

The PCI-DAS4020/12 board is powered by the PCI bus. The only power used is +5 V.

Input impedance configuration

Each analog input and the trigger/clock input channel on the PCI-DAS4020/12 has a dedicated solder gap. A
solder gap consists of two copper pads that you can solder together to change the input impedance of the
channel. When the solder gaps are open (default), the input impedance is 1.5 MΩ. When the solder gaps are
closed, the input impedance is 50 Ω.

To close the solder gaps and change the impedance to 50 ohm, solder the two copper pads together. To close the
solder gap, touch a soldering iron to the two contacts until some rosin core solder flows across the copper pads
and forms a small blob of solder. Be careful not to overheat the pads, or they may delaminate from the circuit
board. Do not add too much solder, as it could flow onto other components and cause an electrical short or other
defect.