ADLINK CoreModule 720 - Manual (Page 24)

Chapter 2 Product Overview
18 Reference Manual CoreModule 720
Thermal/Cooling Requirements
The CPU is the primary source of heat on the board. The CoreModule 720 is designed to operate at the
maximum speed of the CPU and requires a cooling solution (available option). See
Table 2-7 for optional
cooling solution temperature qualifications. Figure 2-10 depicts height measurements of the optional
cooling assemblies.
Figure 2-10. Stack Heights of Cooling Assemblies
Table 2-7. ADLINK Optional Cooling Solutions
Cooling Solution Description
Passive Heatsink - Copper
(without fan) Qualified to maintain optimal performance between -40°C and +85°C.
(Note: The E680T CPU is qualified only for -20°C to +70°C with a
copper heatsink.)
Passive Heatsink - Aluminum
(without fan) Qualified to maintain optimal performance between -20°C and +70°C.
(Note: The E680T CPU is not qualified to use an aluminum heatsink.)
Active Heatsink
(with fan) Qualified to maintain optimal performance between -40°C and +85°C.
(Note: The E680T CPU requires an active heatsink for temperatures
between +70°C and +85°C.)
NOTE All heights are given in inches. Copper and aluminum passive cooling
assemblies share the same height measurements.
0.39 0.44
0.20
0.09
CM720_Cooling_Assy_hts_b
0.09
1.18
2.66
0.98
0.32
2.46 Active Heatsink
CoreModule 720
Fan
1.48
0.39 0.44
Passive Heatsink
CoreModule 720